Packaging Engineer jobs in Yokneam

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in an inclusive, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. NVIDIA is a fast-growing world leader supporting the most powerful supercomputers worldwide. Our networking products lead the industry and connect thousands of GPUs. We make outstanding artificial intelligence possible through innovative networking and computing integration. We value our people and seek excellent individuals to join us! We are looking for an experienced packaging, technology and manufacturability expert to help us build the next generation of networking products. Our networking devices depend heavily on advanced packaging methods like chiplet integration, 2.5D interposers, and co-packaged optics. Packaging choices influence schedule, cost, and yield equally with the silicon. We are looking for a packaging and manufacturability lead who will own the package technical view across our chip programs. This role partners with the advanced technology group to push technology limits in future products. Joining an outstanding team, you will highlight package risks early, bring manufacturability into design choices before they are fixed, and find co-design approaches that improve module yield. Join us in making an impact on all networking products and pushing the boundaries of technology. What you’ll be doing: • Lead the technical assessment of package risk across our chip programs — identifying failure modes in substrate, interposer and assembly integration before they reach silicon, quantifying their cost and schedule impact, and bringing them to program and technology reviews with a clear position • Drive new approaches to manufacturability across the board (package, substrate, interposer, silicon), spanning yield improvement, capacity and supply review, test strategy, thermal and assembly process maturity. Push co-design levers such as tolerance relaxation by design, testability before attach, design margins, and redundancy and partial-module recovery • Analyze module yield mechanics, reconcile predicted versus actual yield on units returning from assembly, and convert the findings into concrete design guidance • Evaluate emerging packaging and photonics technologies, including outside partner solutions, and define our product requirements — working closely with our advanced technology group What we need to see: • B.S or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science or equivalent experience • More than 15 years of experience in package technology development or system integration, with multiple products carried through assembly • Deep understanding of 2.5D, chiplet and organic substrate integration. Working knowledge of assembly and module yield mechanics, including how alignment tolerance and process excursions drive assembly yield differently from defect density at the die level • Strong analytic capabilities, and passion for solving demanding technical problems • Ability to drive complex activities involving many interfaces and teams, and to hold a technical position across organizations Ways to stand out from the crowd: • Hands-on experience on an assembly floor, a foundry or at an OSAT • Experience with co-packaged optics, photonic packaging, or fiber and laser attach • Proven experience driving design-for-manufacturability into early architecture decisions • Familiar with working on large high-end ASICs and multi-die modules Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com/

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. Are you ready to take your engineering career to the next level? NVIDIA, a world-class technology company, is seeking a passionate Package Engineer to join our team in Israel. In this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated IC substrates for our groundbreaking products. At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues. What you will be doing: • Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance. • Review manufacturability readiness at each milestone. • Work with world leading vendors to develop highly challenging packaging solutions. • Leading the development of groundbreaking microelectronics packaging for NVIDIA Networking Business Unit's future products • Collaborating with world-leading vendors to develop highly ambitious packaging solutions • Thriving in a dynamic and challenging environment • Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards. • Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards. • Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain. What we need to see: • BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience. • 2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing. • Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications. • Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools. • High awareness for quality, robustness, and manufacturability. • High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach. • Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations. • Curious and creative problem solver, well organized and multi-tasker. Ways to stand out of the crowd: • Hands-on FEA mechanical simulation experience - Advantage • Team / Group / Project management - Advantage • Experience with manufacturing environment and manufacturing statistics tools • Background in engineering semiconductor manufacturing processes Join us at NVIDIA, an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know, and we will work with you to meet your needs. Apply now to be part of our world-class team and contribute to the future of computing! Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com