Packaging Engineer jobs in Israel

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com. Role Overview Astera Labs is establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters. As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling Astera Labs’ products to operate reliably in the world’s most demanding AI and cloud environments. Key Responsibilities • Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing • Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration) • Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices • Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints • Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance • Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets • Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp • Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews Basic Qualifications • 10+ years of hands-on IC BIG package design experience for high-performance semiconductor products, with full ownership from concept through tape-out • Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and experience designing complex packages (BGA, FCBGA, FCCSP) • Strong package architecture & integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership • Deep understanding of signal, power, and thermal integrity at the package level, with ability to drive design tradeoffs based on analysis • Proven manufacturing and release experience, including DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs Preferred Qualifications • Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces • Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.) • Experience supporting chiplet-based architectures and heterogeneous integration • Prior technical leadership or package ownership on high-volume products We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in an inclusive, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. NVIDIA is a fast-growing world leader supporting the most powerful supercomputers worldwide. Our networking products lead the industry and connect thousands of GPUs. We make outstanding artificial intelligence possible through innovative networking and computing integration. We value our people and seek excellent individuals to join us! We are looking for an experienced packaging, technology and manufacturability expert to help us build the next generation of networking products. Our networking devices depend heavily on advanced packaging methods like chiplet integration, 2.5D interposers, and co-packaged optics. Packaging choices influence schedule, cost, and yield equally with the silicon. We are looking for a packaging and manufacturability lead who will own the package technical view across our chip programs. This role partners with the advanced technology group to push technology limits in future products. Joining an outstanding team, you will highlight package risks early, bring manufacturability into design choices before they are fixed, and find co-design approaches that improve module yield. Join us in making an impact on all networking products and pushing the boundaries of technology. What you’ll be doing: • Lead the technical assessment of package risk across our chip programs — identifying failure modes in substrate, interposer and assembly integration before they reach silicon, quantifying their cost and schedule impact, and bringing them to program and technology reviews with a clear position • Drive new approaches to manufacturability across the board (package, substrate, interposer, silicon), spanning yield improvement, capacity and supply review, test strategy, thermal and assembly process maturity. Push co-design levers such as tolerance relaxation by design, testability before attach, design margins, and redundancy and partial-module recovery • Analyze module yield mechanics, reconcile predicted versus actual yield on units returning from assembly, and convert the findings into concrete design guidance • Evaluate emerging packaging and photonics technologies, including outside partner solutions, and define our product requirements — working closely with our advanced technology group What we need to see: • B.S or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science or equivalent experience • More than 15 years of experience in package technology development or system integration, with multiple products carried through assembly • Deep understanding of 2.5D, chiplet and organic substrate integration. Working knowledge of assembly and module yield mechanics, including how alignment tolerance and process excursions drive assembly yield differently from defect density at the die level • Strong analytic capabilities, and passion for solving demanding technical problems • Ability to drive complex activities involving many interfaces and teams, and to hold a technical position across organizations Ways to stand out from the crowd: • Hands-on experience on an assembly floor, a foundry or at an OSAT • Experience with co-packaged optics, photonic packaging, or fiber and laser attach • Proven experience driving design-for-manufacturability into early architecture decisions • Familiar with working on large high-end ASICs and multi-die modules Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com/

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. Are you ready to take your engineering career to the next level? NVIDIA, a world-class technology company, is seeking a passionate Package Engineer to join our team in Israel. In this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated IC substrates for our groundbreaking products. At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues. What you will be doing: • Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance. • Review manufacturability readiness at each milestone. • Work with world leading vendors to develop highly challenging packaging solutions. • Leading the development of groundbreaking microelectronics packaging for NVIDIA Networking Business Unit's future products • Collaborating with world-leading vendors to develop highly ambitious packaging solutions • Thriving in a dynamic and challenging environment • Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards. • Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards. • Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain. What we need to see: • BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience. • 2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing. • Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications. • Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools. • High awareness for quality, robustness, and manufacturability. • High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach. • Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations. • Curious and creative problem solver, well organized and multi-tasker. Ways to stand out of the crowd: • Hands-on FEA mechanical simulation experience - Advantage • Team / Group / Project management - Advantage • Experience with manufacturing environment and manufacturing statistics tools • Background in engineering semiconductor manufacturing processes Join us at NVIDIA, an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know, and we will work with you to meet your needs. Apply now to be part of our world-class team and contribute to the future of computing! Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com

Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. What We Offer Location: Rehovot,ISR You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. As a Mechanical Engineer, you’ll leverage your strong foundation in physics, mathematics, and materials science to process and resolve mechanical problems, design and implement custom mechanical tooling and associated processes, and enable the handling, assembly, and disassembly of parts, components, sub-assemblies, and final assemblies throughout the product life cycle. You'll be responsible for designing, developing, and modifying mechanical engineering layouts, schematics, and specifications. You will oversee manufacturing and installation processes, ensuring adherence to industry standards and regulations-- and you'll coordinate the procurement and assembly of mechanical components and equipment for design projects, identifying sources of critical parts and subsystems to resolve technical issues. Packaging Engineer We are looking for a highly talented mechanical engineer/packaging engineer to join our testers & jigs team that supports jigs design , Technical changes, continuous product improvement requirements and more. What’s in it for you? • Working in an amazing company, within an exciting, supporting and challenging group. • High challenges technical aspects due to tight environmental specs, high level of cleanliness requirements, different shipment requirements (air, sea), different storage conditions and others. Our Group: Jigs and PCR’s The team is part of the PDC engineering group, working in tight collaboration with the R&D department and all operation teams including manufacturing, materials, Industrial engineers, supplier engineers and others. The team is managing the PCR’s from manufacturing, jigs design and various of engineering tasks to support the organization's growth. What you should have? • 3-5 years’ experiences in mechanical design. • Project management capabilities. • Packaging design experience -advantage, • CAD experience with SolidWorks and Inventor, knowledge with TeamCenter – must and other operational systems. Skills to lead and manage technical projects. • High motivation and passion, Team player, good collaboration with others, self-learning and ability to work alone Who we are? Applied Materials Israel is home to the Process Diagnostics and Control business unit (PDC). Based in Rehovot, we develop, manufacture and market cutting-edge machine learning and computer vision-based metrology and inspection products that are essential elements in wafer fabrication. By playing a significant role in enabling the production of the next generation of microchips, our expertise enables our customers to transform possibilities into reality. Job Description Manage, lead development and designs packaging equipment and materials for safe, cost effective and convenient transport of goods under a variety of conditions. • Support operations on all packaging-related aspects throughout the product lifecycle. • Provide guidance on packaging material selection, qualification, and alignment with operational and cleanliness requirements. • Develop, maintain, and improve packing and unpacking procedures to ensure safe handling, transportation, and installation of products. • Define temporary or alternative packaging solutions for materials and components that do not have an established packaging configuration. • Resolve packaging-related issues involving cleanroom environments, contamination control, and cleanliness protocol compliance. • Evaluate and implement packaging solutions that meet cleanroom, logistics, and customer requirements. • Re-define, optimize, or develop packaging configurations for End-of-Life (EOL) products and legacy systems with undefined packaging standards. • Collaborate with engineering, manufacturing, logistics, suppliers, and field teams to ensure packaging readiness and compliance. • Support root-cause analysis and corrective actions for packaging, handling, transportation, and cleanliness-related issues. • Drive continuous improvement initiatives to enhance packaging efficiency, product protection, cost effectiveness, and operational performance. Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Not Specified Relocation Eligible: No Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.