Failure Analysis Engineer jobs in Israel

Description SolarEdge is a top global leader, manufacturing smart energy solutions. The company's broad range of products encompasses intelligent inverter and storage systems, revolutionary EV charger, and by doing that, we are changing the way electricity is being produced and consumed around the world. In this position, We looking for talented Hardware Engineer with R&D Experienced who ready to change the job title to FA Engineer in Q&R. you will be involved in various aspects of the electronic design. As Solaredge puts a high value on providing best in class product quality and reliability, you will play a critical role in the success of the overall organization. You will be responsible for conducting failure analysis during manufacturing process or service period, determine the root causes and define corrective actions to prevent future occurrences and make sure we are producing best products worldwide. In this position, you will bring deep theoretical background and multidisciplinary understanding. What you will be doing: • Performing design review for different SolarEdge products from the system and architecture level through implementation in design and layout. • Lead failure analysis processes for company's products. Determine root cause for failures under investigation and implement corrective actions. • Support Electrical failure analysis process in production and train technicians Requirements Requirements: • B.Sc. in electrical engineering from a leading university. • Experience in Board design - Advantage • Experience in Digial/Analog/RF design. • Experience with lab equipment (Oscilloscope, DVM, Signal generator, Spectrum analyzer, LCR meters, etc.) • Must possess excellent skills in problem-solving, self-learning, presentation and teamwork. • Good verbal and written communication (English). • Board Bring Up and Debugging experience -advantage

NVIDIA networking IC product engineering team is looking for a talented engineer to join our growing failure analysis team and support various activities of IC failures investigations in order to enable smooth products bring up, optimizing yield and quality, handle customer returns, and be critical part of product qualification that requires root cause finding for every failure encountered. What You Will Be Doing • Utilizing testers and different HW in combination with optical fault isolation techniques such as: Laser stimulations (OBIRCH, LADA, etc.), Laser probing and emission microscopy, to detect defects, chip design marginalities, process issues, etc. • Modify test programs to fit FA requirement. • Interpret ATPG diagnosis reports • Based on the OFI/diagnosis findings, prepare plans for nano-probing and guide Physical FA engineers in their work and PFA plan. • Prepare technical reports summarizing the findings. • Development of novel and existing debug techniques. • Working directly with the job requestors (Q&R, Foundry, physical design) and supporting teams (Test, DFT, SW, physical design). What We Need To See • B.Sc. in Electrical/Computer Engineering, Physics, Materials Science, or related field with 5+ years of relevant experience; or M.Sc. with 3+ years; or Ph.D. • Good understanding of VLSI circuit design, and/or device physics, and/or process engineering. • Ability to work independently, and as part of a team. • Strong sense of ownership, commitment, and responsibility • Effective oral and written communication skills. • Strong analytical problem solving Ways To Stand Out From The Crowd • Experience in Failure analysis, Si debug, ATE test development or nanoprobing • Familiarity with ATE Test Programs, and ability to adopt Test Patterns per debug needs • Statistical/data analysis experience (Matlab, JMP, etc.) • Hands-on experience with different OFI techniques such as: laser stimulations, laser probing, photon emission, thermal emission • Background with electronic test equipment: scopes, spectrum analyzers, lock-in amplifiers, parametric analyzers, VNA, TDR, etc. Widely considered to be one of the technology world’s most desirable employers, NVIDIA is an industry leader with groundbreaking developments in High-Performance Computing, Artificial Intelligence, and Visualization. NVIDIA has some of the most forward-thinking and talented people in the world working for us. If you're creative and autonomous, we want to hear from you!

Description Quantum Machines Ltd is the global leader in control systems for quantum computing, providing the hardware and software tools researchers and businesses need to build quantum computers from the ground up. We are pushing the envelope in a field on the verge of exponential growth, bringing about opportunities like those made possible with the invention of classical computing 50 years ago. We are assembling the strongest team of professionals in the world with the goal of revolutionizing how quantum computers are built and controlled while accelerating their arrival. Come join a multi-disciplinary, world-class team and work on a new class of problems at the cutting edge of technology, science, and business. We are seeking an experienced Team Leader to lead our Failure Analysis engineering group within the Product Engineering team. You will be responsible for controlling and improving the quality of our hardware products through technical leadership, data-driven insights, and global production support. This role requires deep expertise in electronics systems, failure methodologies, production process control, and proven leadership capabilities across multiple geographies. Key Responsibilities • Lead, mentor, and develop a team of failure analysis engineers while providing technical guidance on complex hardware issues. • Drive continuous improvement of quality KPIs through root cause analysis (RCA), statistical analysis, and yield optimization across all products. • Establish and implement standardized failure analysis methodologies, debug protocols, and quality control processes across global production sites. • Serve as the technical focal point for product design and functionality, supporting the team across RF, embedded, FPGA, high-speed communication, and mixed-signal systems. • Collaborate across Design, Manufacturing, Supply Chain, and Sales teams to resolve critical issues and prevent yield impact. • Manage vendor/supplier escalations and conduct design DFT/DFM (Design for Test/Manufacturability) analyses. • Lead investigation of production crises and manage critical path issues under time pressure. Requirements • 6+ years in hardware design and failure analysis; minimum 2 years in a leadership role- Must. • Deep understanding of electronics production processes, DFT principles, and manufacturing constraints- Must. • Strong hands-on lab expertise: proficiency with oscilloscopes, logic analyzers, VNA, and automated test equipment-Must. • Demonstrated experience with production testing workflows, yield analysis, and statistical process control. • Proven ability to conduct systematic root cause analysis and communicate findings to senior management. • Excellent cross-functional collaboration and technical communication skills. • Bachelor's degree in Electronics Engineering or equivalent. Preferred Qualifications • Experience with DFT and DFM analysis. • Proficiency in Python or data analysis tools (MATLAB, Jupyter, etc. • Knowledge of Six Sigma or formal quality methodologie.