Board Design Engineer jobs in Israel

Description SolarEdge (NASDAQ: SEDG) is a global leader in high-performance smart energy technology, with over 3000 employees, offices in 34 countries, and millions of products installed in over 133 countries. Our diverse product offering comprises intelligent solar inverters, battery storage, backup systems, EV charging, and complete home energy management ecosystems. By leveraging world-class engineering capabilities and with a relentless focus on innovation, we strive to create a world where clean, green energy from the sun is the primary source of power for our homes, businesses, and just about everywhere we thrive. We are looking for an experienced PCB Layout Designer to join our Layout Design team within the SolarEdge Hardware division. The Layout Design team is responsible for the layout of all core Hardware products, including High-Voltage power boards, optimizers, communication circuits, and complex battery management systems (BMS). This is a highly challenging role where you will work in a dynamic, fast-paced environment, handling multiple priority projects under tight schedules while working closely with Hardware, Q&R, and Mechanical engineers. What you will do: • Design and develop multi-layer PCB layouts from concept to production, including placement, routing, and final manufacturing outputs. • Translate schematics into optimized layouts considering Signal Integrity (SI), Power Integrity (PI), EMI/EMC mitigation, thermal, and manufacturability constraints. • Work in a Cadence Allegro and OrCAD Capture environment, including the use of parallel layout tools like Symphony to accelerate delivery. • Collaborate closely with Mechanical engineers (handling 3D IDF/IDX transfers), R&D teams, and Reliability (Q&R) teams to meet strict mechanical constraints. • Strictly adhere to our internal "Design Considerations" guidelines and the team's layout "Cookbook" methodologies to ensure standardized execution. Requirements • At least 3 years of hands-on experience with complex PCB layout. • High proficiency with OrCAD PCB Designer / Cadence Allegro. • Deep experience with constraint-driven layout design and Allegro Constraint Manager. • Proven experience with High-Voltage (HV) design, heavy copper routing, and advanced grounding/net-spacing practices. • Strong understanding of Signal Integrity (SI), Power Integrity (PI), high-speed routing, and mixed-signal (digital/analog) considerations. • Deep knowledge of DFM/DFA/DFT considerations, including ICT/ATE test point placement, thermal reliefs, and manufacturing limitations such as wave, laser, and robotic soldering. • Experience in tape-out procedures, generating ODB++/Gerber files, and preparing complete manufacturing packages. • Highly motivated, self-learning, with excellent communication skills to thrive in a cross-functional team.

Description SolarEdge (NASDAQ: SEDG) is a global leader in high-performance smart energy technology, with over 3,000 employees, offices in 34 countries, and millions of products installed in over 133 countries. Our diverse product offering comprises intelligent solar inverters, battery storage, backup systems, EV charging, and complete home energy management ecosystems. By leveraging world-class engineering capabilities and maintaining a relentless focus on innovation, we strive to create a world where clean, green energy from the sun is the primary source of power for our homes, businesses, and beyond. We are looking for an experienced Layout Design Team Leader to lead a team of PCB Layout Designers within the SolarEdge Hardware division. The team is responsible for the PCB layout of our core hardware products, including high-voltage power boards, optimizers, communication circuits, and complex battery management systems (BMS). This is a hands-on leadership role combining people management, technical ownership, and active involvement in complex PCB layout projects. You will develop the team’s capabilities, drive design quality, and manage priorities across multiple projects, working closely with Hardware, Quality & Reliability (Q&R), Mechanical, and Manufacturing teams to deliver robust, production-ready designs. What you will do: • Lead, mentor, and develop a team of PCB Layout Designers, providing technical guidance, ongoing feedback, and support for professional growth. • Own the team’s work plan, resource allocation, priorities, and delivery schedules across multiple concurrent projects. • Lead PCB layout activities from concept through production release, ensuring design quality, compliance with requirements, and timely execution. • Take a hands-on role in designing complex multi-layer PCBs, including placement, routing, verification, and preparation of final manufacturing outputs. • Guide the translation of schematics into optimized layouts, addressing Signal Integrity (SI), Power Integrity (PI), EMI/EMC, high-voltage spacing, thermal performance, and manufacturability requirements. • Conduct layout reviews, resolve technical challenges, and support the team in making design trade-offs. • Drive effective use of Cadence Allegro, OrCAD Capture, Allegro Constraint Manager, and collaborative layout tools such as Symphony. • Coordinate closely with Hardware, Mechanical, Q&R, and Manufacturing engineers to align requirements, resolve constraints, and support the transition to production. • Own and continuously improve the team’s design guidelines, layout methodologies, review processes, and internal layout “Cookbook.” • Oversee tape-out and manufacturing release activities, ensuring complete, accurate, and controlled documentation packages. • Support recruitment and onboarding of new team members. Requirements • At least 5 years of hands-on experience in complex, multi-layer PCB layout design. • Previous experience leading a PCB layout team or providing technical leadership, mentoring, and coordination across multiple layout projects. • High proficiency in Cadence Allegro / OrCAD PCB Designer, with strong knowledge of OrCAD Capture. • Deep experience with constraint-driven layout design and Allegro Constraint Manager. • Proven experience with high-voltage design, heavy copper routing, grounding strategies, and electrical clearance and creepage requirements. • Strong understanding of Signal Integrity (SI), Power Integrity (PI), high-speed routing, and mixed-signal digital/analog design considerations. • In-depth knowledge of DFM/DFA/DFT requirements, including ICT/ATE test point placement, thermal reliefs, and manufacturing constraints associated with wave, laser, and robotic soldering. • Experience with tape-out procedures, ODB++/Gerber generation, and preparation and review of complete manufacturing packages. • Experience collaborating with Mechanical engineers using 3D IDF/IDX interfaces. • Ability to prioritize workloads, allocate resources, and drive multiple projects to completion under tight schedules. • Strong leadership, communication, and interpersonal skills, with the ability to develop people and drive effective cross-functional collaboration. • A proactive, accountable approach, with strong problem-solving skills and a commitment to continuous improvement.

Description TriEye is a deep tech company turning scientific breakthroughs into transformative sensing and electro optical capabilities. Built on cutting edge research in nanophotonics, semiconductors, and advanced optics, we develop proprietary technologies that push beyond the limits of conventional sensing, enabling systems to see, detect, understand, and act in ways that were previously impractical or impossible. At the core of our technology is a new approach to SWIR sensing, enabled by our breakthrough CMOS based platform. But our innovation extends far beyond the sensor itself. By combining advanced semiconductor design, nanophotonics, proprietary laser and illumination technologies, computational sensing, and deep system level engineering, we create tightly integrated solutions with fundamentally new capabilities, not simply better performance or lower cost. This full stack approach allows TriEye to rethink sensing from the physics up, translating advances at the material and device level into meaningful advantages at the system and application level. We are looking for exceptional talent to join our team as a Hardware Engineer. Your Day to Day • Lead end-to-end hardware development, from architecture and design to testing and production • Design and develop complex electronic systems, including schematics, PCB layout guidance, and component selection • Drive system integration, bring-up, debugging, and validation processes • Collaborate with firmware, software, mechanical, and product teams to ensure seamless system performance • Identify technical risks and propose effective mitigation strategies • Support manufacturing, including design for manufacturability (DFM) and design for testability (DFT) • Analyze and improve system performance, reliability, and cost • Mentor junior engineers and contribute to team knowledge sharing Requirements • BSc or MSc in Electrical Engineering or a related field • 7+ years of experience in hardware development in high-tech industries • Strong experience with analog and digital design • Proven track record of taking products from concept to production • Hands-on experience with lab equipment (oscilloscopes, spectrum analyzers, logic analyzers, etc.) • Experience with schematic capture and PCB design tools • Strong debugging and problem-solving skills • Ability to manage multiple projects in a dynamic environment • Experience with high-speed interfaces, RF systems, or sensor technologies • Hands-on experience with Altium Designer and familiarity with AMD SoC platforms - Advantage • Familiarity with embedded systems and firmware integration • Experience working with contract manufacturers and NPI processes • Knowledge of industry standards and compliance requirements • Fluent in English, both verbal and written Why should you be a TriEyoneer? • Work at the edge of what’s possible Turn scientific breakthroughs in sensing, photonics, and semiconductors into capabilities that were previously impractical or impossible. • Build what others can’t Work across physics, hardware, software, and algorithms to build complex systems from first principles and take them all the way to real world deployment. • See your work make an impact Build technology that moves beyond the lab into demanding real world applications across defense, robotics, industrial, and emerging markets. • Grow with exceptional people Join a multidisciplinary team that values ownership, curiosity, technical excellence, and pushing boundaries together. • Enjoy the journey Modern offices in Tel Aviv with easy access to public transport, plus a competitive benefits package including gym, parking, Cibus, generous vacation, and team events. General statement TriEye is an equal-opportunity employer. Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or protected veteran status.

Description Board Design Engineer Location: Raanana #LI-Hybrid About Us: DriveNets is a leader in disaggregated high-scale solutions for service providers and AI infrastructures. Founded in December 2015, DriveNets created a radical new way to build networks by adapting the architectural model of the cloud to telco-grade . This solution accelerates deployment, improves the ’s economic model, and radically simplifies operations. With customers including Comcast, Orange, and KDDI - over 80% of AT&T’s traffic now runs through a disaggregated core powered by DriveNets software. DriveNets Cloud-AI solution, based on the same technology, was introduced to the market in 2023, providing the highest-performance Ethernet-based AI solution, and is already deployed by Hyperscalers, NeoClouds and Enterprises. Raising over $587 million in three funding rounds, DriveNets continues to deploy the most innovative infrastructure and is looking for the most talented people to be part of this journey. The Role We are seeking a highly skilled and experienced multidisciplinary engineer with a strong background in system design to join our team. In this role, you will contribute to our upcoming projects and play a key part in the rapid expansion of the Ethernet market. As a such, you will be responsible for developing high-speed digital and analog circuit boards used in Ethernet products. Your duties will include designing board schematics, overseeing PCB layout, and conducting lab . Additionally, you will be responsible for evaluating new hardware solutions, providing technical leadership in troubleshooting and reviewing schematics, layouts, and design for manufacturability (DFM), as well as managing components selection. Requirements • Bachelor's or Master's degree in Electrical Engineering with 5+ years of relevant experience in hardware/board design- Must. • Expertise in PCB technology and layout for both analog and digital circuits, including stack-up, placement, routing, and signal/power integrity (SI/PI) for high-speed (ETH112G, PCIe Gen5, DDR5, etc.) and high-power systems. • Hands-on experience in high-precision signal measurement and system engineering. • Strong troubleshooting skills, with the ability to diagnose issues, identify root causes, and implement corrective actions. • Excellent verbal and written communication skills in English, enabling collaboration with design, evaluation, and production engineers, customers, technical marketing engineers, and program managers. • In-depth understanding of system architecture. • Programming knowledge and experience (a plus but not required).

Mobileye develops purpose-built hardware and AI technologies that power advanced driver-assistance and autonomous-driving solutions. Our EyeQ™ SoCs and imaging radar technologies are designed to deliver scalable, automotive-grade performance and help enable safer mobility worldwide. Join our advanced packaging team and take ownership of package-substrate layout for cutting-edge digital and RF products. You will collaborate with silicon, package, SI/PI, PCB, manufacturing, and OSAT teams to deliver high-quality, manufacturable package layouts that meet demanding automotive requirements What will your job look like: • Own IC package-substrate layout from feasibility through manufacturing release. • Perform die placement, bump fan-out, ball-map planning, package-size estimation, and layer planning. • Set up stack-ups, padstacks, design rules, and layout constraints. • Implement high-density bump-to-ball routing for signal, power, and ground nets. • Route high-speed and RF interfaces according to defined SI/PI constraints. • Perform DRC, connectivity, LVS/netlist, and DFM checks. • Generate artwork, fabrication drawings, reports, and release documentation. • Resolve layout-related queries from substrate manufacturers and OSATs. All you need is: • B.Sc. in Electrical Engineering or a related field, or equivalent practical experience. • 5+ years of hands-on IC package-substrate layout experience. • Strong proficiency with Cadence Allegro Package Designer. • Experience with flip-chip BGA, bump fan-out, ball-map optimization, and multilayer substrate routing. • Experience working from schematics, netlists, design rules, and constraint documents. • Good understanding of high-speed layout principles, including differential pairs, length matching, spacing, and return paths. • Good understanding of power-delivery and power-integrity layout principles, including power and ground plane design, current-carrying requirements, and via-array implementation. • Experience with DRC, connectivity verification, DFM, and manufacturing-data release. • Strong attention to detail and the ability to independently own designs through release. Nice to have: • Experience with RF, SiP, multi-die, interposer, or 2.5D package layouts. • Experience with DDR, PCIe, SerDes, MIPI, or UFS interfaces. • Experience with Siemens Xpedition Package Designer or CAM350. • Experience working directly with substrate manufacturers and OSATs. • Experience with scripting for package-layout automation. Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!

HW CE Group is responsible for customer engineering across Mobileye's various projects. We're seeking a talented and experienced HW Engineer to take ownership of projects from the block diagram review stage through all bring-up stages and into the field, including HW schematics and layout design reviews, HW bring-up, debugging, SW interface support, and general customer engineering. The work includes collaboration with various internal and external teams across relevant disciplines. What will your job look like: • Review digital board schematics, including high-speed interfaces, power designs, multilayer PCB layouts using various tools, SI/PI simulation reports, mechanical designs and thermal/mechanical simulations, validation, and automotive qualification tests (DV/PV). • Execute board bring-up and maintain relevant documentation. • Lead debugging activities internally and with other teams and customers through resolution. • Participate in conference calls with customers. • Guide various test procedures. All you need is: • B.Sc. in Electrical / Electronic Engineering from a recognized institution. • Strong system-level understanding and hands-on board debugging experience. • Experience with board design tools and laboratory equipment (oscilloscope, logic analyzer, etc.). • Strong interpersonal skills and ability to work effectively across teams. • Independent, organized, and able to manage multiple tasks in parallel. • High level of English. Nice to have: • Experience in digital HW board design. • Good understanding of SI/PI in multilayer PCB design. • Experience in Customer Engineering. • Experience using AI tools to improve work processes. Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!